doi: 10.7763/IJCTE.2013.V5.779
New Assembling-Disassembling Technology Using Electromagnetically Active Adhesives-Dielectric Behaviour
Vasilica Alina Neamtu
,
Ramona Burlacu ,
Cristina Bratescu ,
Stefan Ursache
- “Gheorghe Asachi” Technical University of Iaşi, Romania, Faculty of Electrical Engineering.
Abstract
The work refers to a new assembling - disassembling technology based on designing functionally graded bonds by incorporating in the adhesive matrix electromagnetically active nanofillers. These kid of modified adhesives applied with various concentrations of nanofillers within the joints, can significantly increase the functionality of the structure when they are activated in electromagnetic field, at different frequencies. In the same electromagnetic field, the insertion of nanoparticles within the joint provides an immediate disassembly mechanism. The electromagnetic field can be switched using specific triggers. We have investigated the dielectric behavior of modified adhesives and the matrix we used was HF2030 with different percent of nanoparticles.
Keywords
- Dielectric measurements
- magnetic nanoparticles
- modified adhesives
- nanostructured adhesives
How to Cite
Vasilica Alina Neamtu, Ramona Burlacu, Cristina Bratescu, and Stefan Ursache, "New Assembling-Disassembling Technology Using Electromagnetically Active Adhesives-Dielectric Behaviour," International Journal of Computer Theory and Engineering, vol. 5, no. 4, pp. 703-706, 2013. https://doi.org/10.7763/IJCTE.2013.V5.779
Copyright & License
Copyright © 2013 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).