General Information
    • ISSN: 1793-8201 (Print), 2972-4511 (Online)
    • Abbreviated Title: Int. J. Comput. Theory Eng.
    • Frequency: Quarterly
    • DOI: 10.7763/IJCTE
    • Editor-in-Chief: Prof. Mehmet Sahinoglu
    • Associate Editor-in-Chief: Assoc. Prof. Alberto Arteta, Assoc. Prof. Engin Maşazade
    • Managing Editor: Ms. Mia Hu
    • Abstracting/Indexing: Scopus (Since 2022), INSPEC (IET), CNKI,  Google Scholar, EBSCO, etc.
    • Average Days from Submission to Acceptance: 192 days
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Prof. Mehmet Sahinoglu
Computer Science Department, Troy University, USA
I'm happy to take on the position of editor in chief of IJCTE. We encourage authors to submit papers concerning any branch of computer theory and engineering.

IJCTE 2013 Vol.5(4): 703-706 ISSN: 1793-8201
DOI: 10.7763/IJCTE.2013.V5.779

New Assembling-Disassembling Technology Using Electromagnetically Active Adhesives-Dielectric Behaviour

Vasilica Alina Neamtu, Ramona Burlacu, Cristina Bratescu, and Stefan Ursache

Abstract—The work refers to a new assembling - disassembling technology based on designing functionally graded bonds by incorporating in the adhesive matrix electromagnetically active nanofillers. These kid of modified adhesives applied with various concentrations of nanofillers within the joints, can significantly increase the functionality of the structure when they are activated in electromagnetic field, at different frequencies. In the same electromagnetic field, the insertion of nanoparticles within the joint provides an immediate disassembly mechanism. The electromagnetic field can be switched using specific triggers. We have investigated the dielectric behavior of modified adhesives and the matrix we used was HF2030 with different percent of nanoparticles.

Index Terms—Dielectric measurements, magnetic nanoparticles, modified adhesives, nanostructured adhesives.

The authors are with the “Gheorghe Asachi” Technical University of Iaşi, Romania, Faculty of Electrical Engineering (e-mail:,,,


Cite:Vasilica Alina Neamtu, Ramona Burlacu, Cristina Bratescu, and Stefan Ursache, "New Assembling-Disassembling Technology Using Electromagnetically Active Adhesives-Dielectric Behaviour," International Journal of Computer Theory and Engineering vol. 5, no. 4, pp. 703-706, 2013.

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